Micron Precision Co., Ltd.

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Mold Division

The company pioneering the future is always near by you.

It is pleasant to introduce Micron Precision Co., Ltd.
We have been making lots of efforts and promise to be the best in this field.

 
Automold Die
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ No Wire-Sweeping & No Voids guaranteed
▶▶ BGA, QFN/MLF, all I.C & Power Packages
   
Semi-MGP Mold
Major Specification
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
▶▶ Transfer pressure control (Balanced, Stable and Fine Control)
   
Conventional Mold
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
   
Retractable E-Pin Mold
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
   
Mold Spare Parts
Major Specification
▶▶ All consumable parts for any kinds of mold
▶▶ Automold parts by Reverse Engineering