Micron Precision Co., Ltd.

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3D Mold Flow

The company pioneering the future is always near by you.

It is pleasant to introduce Micron Precision Co., Ltd.
We have been making lots of efforts and promise to be the best in this field.

Uneven compound flow before 3D mold flow simulation applied
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Even compound flow after 3D mold flow simulation applied
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Detailed 3D mold flow for Package filling
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I. Introduction of the unparalleled 3D『MoldFlow』Simulation
1. Original Purpose
▶▶ To optimize the design of L/F & Package
▶▶ By simulating the pattern of resin filling inside package
▶▶ At initial stage of developing a new package
2. Application
▶▶ Molding quality problems such as Voids, Incomplete Fill, Wire Sweep, etc, can be detected & resolved in pre-emptive manner without having to engage in the cycle of trial and error.
II. Simulation Procedure (Lead-time : 2 weeks)
▶▶ Data Collection : Application of Package & L/F
▶▶ Analysis on existing mold design
▶▶ Drawing amendment as per 3D simulation
▶▶ New parts fabrication for test and evaluation
▶▶ Actual test(Book Mold test)
▶▶ Comparison of evaluation data with 3D simulation
▶▶ Optimization on Variable data
▶▶ Final Optimization
Flow-Front Shapes (at 4.9s)
Simulation View Actual Shot Sample
Normal Conventional Mold
Melt-Front Advancement : 2D View Wire Sweep (Simulation & Experiment)
Even Flow (Simulation & Experiment)
2D View 3D View Details of 3D View