미크론정공(주)

홈 > 제품소개 > 금형사업부
금형사업부

미래를 내다보는 기업 가까운 곳에 있습니다.

미크론정공(주)은 반도체 금형장비 전문 기업으로써 지금까지 노력해 왔습니다.
항상 최고를 향해 나갈 것을 약속 드립니다.

 
Automold Die
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ No Wire-Sweeping & No Voids guaranteed
▶▶ BGA, QFN/MLF, all I.C & Power Packages
   
Semi-MGP Mold
Major Specification
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
▶▶ Transfer pressure control (Balanced, Stable and Fine Control)
   
Conventional Mold
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
   
Retractable E-Pin Mold
Major Specification
▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound
▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil
▶▶ No Resin & No Flash guaranteed
▶▶ Wire-Sweeping & Void : Same as Automold
▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold
   
Mold Spare Parts
Major Specification
▶▶ All consumable parts for any kinds of mold
▶▶ Automold parts by Reverse Engineering