미크론정공(주)

미래를 내다보는 기업 가까운 곳에 있습니다.

미크론정공(주)은 반도체 금형장비 전문 기업으로써 지금까지 노력해 왔습니다.
항상 최고를 향해 나갈 것을 약속 드립니다.

Automold Die Major Specification ▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil ▶▶ No Resin & No Flash guaranteed ▶▶ No Wire-Sweeping & No Voids guaranteed ▶▶ BGA, QFN/MLF, all I.C & Power Packages     Semi-MGP Mold Major Specification ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil ▶▶ No Resin & No Flash guaranteed ▶▶ Wire-Sweeping & Void : Same as Automold ▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold ▶▶ Transfer pressure control (Balanced, Stable and Fine Control)     Conventional Mold Major Specification ▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil ▶▶ No Resin & No Flash guaranteed ▶▶ Wire-Sweeping & Void : Same as Automold ▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold     Retractable E-Pin Mold Major Specification ▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil ▶▶ No Resin & No Flash guaranteed ▶▶ Wire-Sweeping & Void : Same as Automold ▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold     Mold Spare Parts Major Specification ▶▶ All consumable parts for any kinds of mold ▶▶ Automold parts by Reverse Engineering