미크론정공(주)은 반도체 금형장비 전문 기업으로써 지금까지 노력해 왔습니다.
항상 최고를 향해 나갈 것을 약속 드립니다.
Uneven compound flow before 3D mold flow simulation applied
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Even compound flow after 3D
mold flow simulation applied
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Detailed 3D mold flow for Package
filling
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I. Introduction of the unparalleled 3D『MoldFlow』Simulation
1. Original Purpose
▶▶ To optimize the design of L/F & Package
▶▶ By simulating the pattern of resin filling inside package
▶▶ At initial stage of developing a new package
2. Application
▶▶ Molding quality problems such as Voids, Incomplete Fill, Wire Sweep, etc, can be detected & resolved in pre-emptive manner without having to engage in the cycle of trial and error.
II. Simulation Procedure (Lead-time : 2 weeks)
▶▶ Data Collection : Application of Package & L/F
▶▶ Analysis on existing mold design
▶▶ Drawing amendment as per 3D simulation
▶▶ New parts fabrication for test and evaluation
▶▶ Actual test(Book Mold test)
▶▶ Comparison of evaluation data with 3D simulation
